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Dr. Michael FritzeProgram Manager
Dr. Michael Fritze joined the DARPA Microsystems Technology Office (MTO) as a Program Manager in August 2006. His interests are in the areas of advanced low power electronics and low volume nanofabrication. Currently, Dr. Fritze is responsible for the 3D Integrated Circuits (3-D IC), Steep-Subthreshold-slope Transistors for Electronics with Extremely-Low Power (STEEP), Radiation Hardening by Design (RHBD), and Technology for Efficient Agile Mixed-Signal Microsystems (TEAM) Program for MTO.
Prior to joining DARPA, Dr. Fritze was a Staff Member from 1995-2006 at MIT Lincoln Laboratory in Lexington, Massachusetts, a Federally-Funded Research and Development Center (FFRDC). At Lincoln Laboratory, he worked on fully-depleted silicon on insulator (FDSOI) technology development with an emphasis on novel devices. Particular interests included highly scaled, tunneling-based, and ultra-low power devices. Dr. Fritze also worked in the area of silicon-based integrated optics. Another research interest at Lincoln Laboratory was in the area of resolution-enhanced optical lithography and nanofabrication with particular emphasis on low volume technological solutions.
Prior to Lincoln Laboratory, Dr. Fritze held a post-doctoral appointment at AT&T Bell Laboratories in Holmdel New Jersey, where he worked in the areas of femtosecond optical spectroscopy and compound semiconductor optical properties. From 1984-1986, Dr. Fritze worked as a technical assistant at Bell Communications Research in Murray Hill, New Jersey, in the area of compound semiconductor quantum well electrical properties.
Dr. Fritze received a Ph.D. in Physics from Brown University in 1994, working in the area of compound semiconductor quantum well physics. He received a B.S. in Physics in 1984 from Lehigh University. Dr. Fritze is an elected member of Tau Beta Pi and Sigma Xi. He is a member of IEEE and SPIE and is active on the program committees of the EIPBN (3Beams) & GOMAC conferences. Dr. Fritze has published over 60 papers and articles in professional journals and holds several U.S. patents.